AKASA T5 Pro-Grade+ Thermal Compound Syringe, 5g, Grey, Ultra-Performance with Hybrid Silicone & Nano-Diamond Particles, Non-Curing

T5 Pro-Grade+ Easily apply ultra-performance hybrid thermal paste to your CPU and GPU, designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications. - Designed with hybrid silicone and nano-diamond particles for ultra-performance - Non-curing and non-electrically conductive properties - Conveniently included wipes and spreader

Nano-Diamond Particles for Superior Heat Transmission Use of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission. Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.

Easy and Safe Application Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.

Conveniently Included Wipes and Spreader Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.

Application Thermally conductive compound

Thermal Conductivity 5.2 W/mK

Specific Gravity 2.6

Form Non-curing compound

Operating Temperature -50°C to 250°C

Thermal Resistance 0.04°C-cm²/W @ 60 psi

Colour Grey

Viscosity 6,000,000 (mPa.s/ 22°C)

Weight 5g